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3624 TRICONEX controller
3624 TRICONEX controller
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How to Build High Channel Density Digital IO Modules for the Next Generation Industrial Automation Controllers
With the rapid development of industrial automation, digital IO modules have become an indispensable part of industrial automation controllers. The digital IO module can connect the controller with external devices, such as sensors, actuators, etc., to achieve monitoring and control of industrial production processes. However, with the continuous development of industrial automation, digital IO modules need to have higher channel density and stronger functionality to meet the needs of new industrial automation controllers. Therefore, it is very important to build high channel density digital IO modules for the next generation of industrial automation controllers.
The digital IO module is one of the most fundamental modules in industrial automation controllers, and its main function is to connect the controller with external devices to achieve signal input and output. The digital IO module usually includes two parts: a digital input module and a digital output module. The digital input module can convert the digital signals of external devices into signals that the controller can read, while the digital output module can convert the digital signals output by the controller into signals that external devices can read. The channel density of a digital IO module refers to the number of digital input or digital output channels provided on the module, which is the input and output capacity of the module.
With the development of industrial automation, digital IO modules need to have higher channel density and stronger functions to meet the needs of new industrial automation controllers. The following are several aspects to consider when building a high channel density digital IO module for the next generation of industrial automation controllers:3624 TRICONEX controller
1. Choose the appropriate communication protocol
Digital IO modules typically communicate with controllers through communication protocols, so choosing a suitable communication protocol is crucial. Common communication protocols include Modbus, Profibus, CANopen, Ethernet, etc. Different communication protocols have different advantages and disadvantages, and selecting a suitable communication protocol requires considering the following factors:
(1) Communication speed: The faster the communication speed, the shorter the response time of the digital IO module, which can process input and output signals faster.
(2) Communication distance: The farther the communication distance, the wider the application range of digital IO modules.
(3) Reliability: The reliability of communication protocols determines the stability and reliability of digital IO modules.
(4) Cost: Different communication protocols have different costs, and suitable communication protocols need to be selected based on actual needs.
2. Choose the appropriate digital IO chip
The digital IO chip is the core component of the digital IO module, and its performance and function directly affect the channel density and function of the digital IO module. Choosing a suitable digital IO chip requires considering the following factors:
(1) Channel density: The channel density of digital IO chips determines the channel density of digital IO modules, and channel density needs to be selected based on actual needs.
(2) Input/output type: Digital IO chips usually support digital input and digital output, and some chips also support functions such as analog input and output, counters, etc.
(3) Speed: The speed of the digital IO chip determines the response speed of the digital IO module, and it is necessary to choose a chip with a faster speed.
(4) Accuracy: The accuracy of digital IO chips determines the signal accuracy of digital IO modules, and it is necessary to choose chips with higher accuracy.
(5) Cost: Different digital IO chips have different costs, and suitable chips need to be selected based on actual needs.
3. Optimize circuit design
The circuit design of digital IO modules has a significant impact on their performance and stability. In order to improve the channel density and functionality of digital IO modules, it is necessary to optimize circuit design, such as:
(1) Using high-speed digital IO chips: Using high-speed digital IO chips can improve the response speed and accuracy of the module.
(2) Adopting anti-interference design: In order to improve the stability of the digital IO module, it is necessary to adopt anti-interference design, such as using filters, isolators, etc.
(3) Using optimized PCB layout: Optimizing PCB layout can reduce noise and interference in digital IO modules, improve module performance and stability.
4. Choose the appropriate shell material and size
Digital IO modules typically need to be installed in cabinets or control cabinets, so choosing the appropriate housing material and size is crucial. The shell material should have good protective and heat dissipation properties to protect the circuits of the digital IO module from external environmental influences. The shell size should be able to adapt to different installation environments, such as cabinets, control cabinets, etc.
5. Optimize software design
The software design of the digital IO module determines its functionality and performance. In order to achieve high channel density and stronger functionality, it is necessary to optimize software design, such as:
(1) Supporting multiple input and output types: Supporting multiple input and output types can meet different application needs, such as digital input and output, analog input and output, counters, etc.
(2) Supporting multiple communication protocols: Supporting multiple communication protocols can adapt to different controllers and application environments.
(3) Support for online debugging and monitoring: Supporting online debugging and monitoring can facilitate user diagnosis and maintenance of modules.
(4) Support for expansion function: Supporting expansion function can increase the functionality and application range of the module while ensuring channel density.
In summary, building a high channel density digital IO module for the next generation of industrial automation controllers requires multiple considerations, including selecting suitable communication protocols, selecting suitable digital IO chips, optimizing circuit design, selecting suitable shell materials and sizes, and optimizing software design. Only by comprehensively considering these factors can a digital IO module with high channel density and stronger functionality be constructed to meet the needs of new industrial automation controllers.
How to assign IO devices to IO controllers?
PROFINET IO system
The PROFINET IO system consists of a PROFINET IO controller and its assigned PROFINET IO devices. After adding IO controllers and IO devices, it is necessary to assign IO controllers to the IO devices to form a basic PROFINET IO system.
Prerequisite requirements
● Already in the network view of STEP 7.
A CPU has been placed (e.g. CPU 1516-3 PN/DP).
● An IO device has been placed (e.g. IM 155-6 PN ST)
Operating Steps (Method 1)
To assign IO devices to IO controllers, follow these steps:
1. Move the mouse pointer over the interface of the IO device.
2. Hold down the left mouse button.
3. Drag the mouse pointer.
The pointer will now use the networking symbol to indicate the “networking” mode. At the same time, you can see a lock character appearing on the pointer
Number. The lock symbol only disappears when the pointer moves to a valid target position.
4. Now, move the pointer to the interface of the desired IO controller and release the left mouse button.
5. Now assign the IO device to the IO controller.
Operating Steps (Method 2)
To assign IO devices to IO controllers, follow these steps:
1. Move the mouse pointer over the word “Unassigned” in the bottom left corner of the IO device icon.
2. Click the left mouse button.
3. Select the IO controller interface to be connected from the available interfaces that appear.
4. Now assign the IO device to the IO controller.
Application Scheme of Industrial Ethernet Remote IO Module in Intelligent Manufacturing Workshop
With the advent of Industry 4.0, intelligent manufacturing has become a trend in industrial production. Intelligent manufacturing requires efficient, stable, and reliable industrial Ethernet remote IO modules to monitor the production process. This article will share an application case of an intelligent manufacturing workshop based on industrial Ethernet remote IO module.3624 TRICONEX controller
The production process of this intelligent manufacturing workshop is mainly divided into two parts: injection molding and automated assembly. The injection molding process requires controlling parameters such as the melting temperature of the melt, the speed and pressure of the injection molding machine. The automated assembly process requires controlling the actions of the assembly robot and detecting the quality of the product. In addition to these production process data, there are also equipment production data such as daily and weekly production in the workshop, as well as equipment status data such as operation, manual, automatic, mold adjustment, and alarm.
In the past, the production process of the factory mainly relied on traditional hard wiring to control the production process, resulting in low work efficiency due to the need for frequent replacement of transmission lines to meet production needs. Moreover, it is very difficult to collect a large number of types of detection and monitoring data for intelligent manufacturing. In order to improve efficiency, production quality, and reliability, the factory has introduced the industrial Ethernet remote IO module MxxT using barium rhenium technology.
The injection molding machine itself comes with MODBUS industrial control bus data or basic status signal output. The barium rhenium technology remote IO module collects data from the device interface RS232/RS485 port, collects status information of the injection molding machine such as startup, operation, and pause, and uploads it to the injection molding machine controller, or wirelessly uploads it to the cloud server. Based on devices, according to the communication protocols and interfaces of different devices, data is obtained by calling their interface channels, and then transmitted to the server.
The remote IO module is connected to the controller of the injection molding machine, and the operation data of the injection molding machine is uploaded and distributed wirelessly, achieving remote monitoring and intelligent control of the injection molding machine. In addition, the remote I/O module supports perceptual access to peripheral devices such as mold temperature machines, cutting machines, and dryers for injection molding machines, providing users with smart factory services.
During the injection molding process, the industrial Ethernet remote IO module transmits real-3624 TRICONEX controllertime data such as temperature, pressure, and speed to the main controller for monitoring and adjustment, ensuring the stability and compliance of production parameters under different conditions. In the automated assembly process, the industrial Ethernet remote IO module collects data through sensors and other devices, and transmits the relevant data to the main controller for adjustment of relevant actions. For example, the industrial Ethernet remote IO module can monitor the actions of assembly robots, detect the accuracy of product assembly and product quality, and ensure the production quality and stability of the product. At the same time, all production data can also be collected and analyzed remotely, helping enterprise managers better monitor production efficiency and quality.
By introducing industrial Ethernet remote IO modules, this intelligent manufacturing workshop not only improves production efficiency and stability, but also reduces labor and energy costs. Because the industrial Ethernet remote IO module can help enterprises complete the collection and monitoring of production data with one click, as well as avoid unnecessary line replacement and the need for workers to enter and exit the production process, thereby reducing costs and improving production efficiency for enterprises.
In summary, the application of industrial Ethernet remote IO modules in intelligent manufacturing workshops not only improves production efficiency and quality, reduces costs, but also achieves intelligent and digital management of production processes, bringing more opportunities and development space for enterprise development.
In addition, this device is widely used for networking and data collection of industrial equipment such as injection molding machines, air compressors, CNC machine tools, on-site PLCs, instruments, sensors, CNC, and electromechanical equipment.
Building a High Channel Density Digital IO Module for the Next Generation Industrial Automation Controller
There are currently many articles introducing Industry 4.0, and smart sensors are becoming increasingly popular in factory environments (I and other authors have written about these topics). Although we have all noticed a significant increase in the use of sensors in factories, processing plants, and even some newly built automation systems, the widespread use of sensors has also brought about an important change, which is the need to handle a large amount of IO within these old controllers. These IOs may be digital or analog. This requires the construction of high-density IO modules with size and heat limitations. In this article, I will focus on digital IO, and in subsequent articles, I will introduce analog IO.
Usually, digital IO in PLC consists of discrete devices such as resistors/capacitors or independent FET drives. In order to minimize the size of the controller as much as possible and to handle 2 to 4 times the number of channels, this has led to a shift from a separate approach to an integrated approach.
We can use the entire article to illustrate the drawbacks of the split method, especially when the number of channels processed by each module reaches 8 or more. However, when it comes to high heat/power consumption, a large number of split components (from the perspective of size and mean time between failures (MTBF)), and the need for reliable system specifications, it is sufficient to demonstrate that the split method is not feasible.
Figure 1 shows the technical challenges faced in building high-density digital input (DI) and digital output (DO) modules. In both Di and DO systems, size and heat dissipation issues need to be considered.
Digital input
size
heat
Supports all input types
Type 1, 2, 3, Input
Supports 24 V and 48 V inputs
Robust operating specifications
Wire breakage detection
Digital output
Support for different types of output driver configurations
size
Integrated demagnetization of inductive loads
Heat – When driving multiple outputs
Drive accuracy
diagnosis
For digital input, it is also important to note that it supports different input types, including 1/2/3 type inputs, and in some cases, 24V and 48V inputs. In all cases, reliable operating characteristics are crucial, and sometimes circuit detection is also crucial.
For digital outputs, the system uses different FET configurations to drive the load. The accuracy of the driving current is usually an important consideration. In many cases, diagnosis is also very important.
We will explore how integrated solutions can help address some of these challenges.
Design a High Channel Density Digital Input Module
The traditional split design uses a resistive voltage divider network to convert 24V/48V signals into signals that can be used by microcontrollers. The front-end can also use discrete RC filters. If isolation is required, external optocouplers are sometimes used.
Figure 1 shows a typical discrete method for constructing digital input circuits.
Figure 1. Considerations for digital input and output modules.
This type of design is suitable for a certain number of digital inputs; 4 to 8 per board. Beyond this number, this design will soon become impractical. This separation scheme can bring various problems, including:
High power consumption and related board high temperature points.
Each channel requires an optocoupler.
Excessive components can lead to low FIT rate and even require larger devices.
More importantly, the split design method means that the input current increases linearly with the input voltage. Assuming a 2.2K Ω input resistor and 24V V is used. When the input is 1, for example, at 24V, the input current is 11mA, which is equivalent to a power consumption of 264mW. The power consumption of the 8-channel module is greater than 2W, and the power consumption of the 32-bit module is greater than 8W. Refer to Figure 3 below
From a cooling perspective alone, this split design cannot support multiple channels on a single board.
One of the biggest advantages of integrated digital input design is the significant reduction in power consumption, thereby reducing heat dissipation. Most integrated digital input devices allow configurable input current limitations to significantly reduce power consumption.
When the current limiting value is set to 2.6mA, the power consumption is significantly reduced, with each channel approximately 60mW. The rated value of the 8-channel digital input module can now be set below 0.5
Another reason for opposing the use of split logic design is that sometimes DI modules must support different types of inputs. The standard 24V digital input specifications published by IEC are divided into Type 1, Type 2, and Type 3. Type 1 and Type 3 are usually used in combination because their current and threshold limits are very similar. Type 2 has a current limit of 6mA, which is higher. When using the split method, it may be necessary to redesign as most discrete values need to be updated.
However, integrated digital input products typically support all three types. Essentially, Type 1 and Type 3 are generally supported by integrated digital input devices. However, in order to meet the minimum current requirement of 6mA for Type 2 input, we need to use two channels in parallel for one field input. And only adjust the current limiting resistance. This requires a circuit board change, but the change is minimal.
What is the difference between remote IO and distributed IO
People often discuss the difference between remote IO and distributed IO. However, some people believe that they are the same and terms can be exchanged, while others believe the opposite. What is the difference between remote I/O and distributed I/O? The following is a guide from remote IO manufacturer Zhongshan Technology to understand the difference between remote IO and distributed IO.
Remote and distributed within the location range.3624 TRICONEX controller
Today”s DCS is a control system with many distributed autonomous controllers, each with many continuous operations. This controller is bundled together by a central monitoring controller. We have used the terms remote and distributed in the locations of I/O and controllers. It is easy to see how these terms are misunderstood.
From the perspective of PLC, remote I/O represents the actual distance that the I/O module is away from the control PLC. Distributed I/O is very intelligent, as mentioned earlier, remote I/O is sometimes referred to as distributed I/O. Let”s take a look at the definition of distributed I/O. This definition is different from remote I/O.
Generally speaking, distributed I/O has a brain or some computing power. By default, it is remote. As mentioned earlier, remote I/O is located physically far from the control PLC. Remote I/O has no brain and cannot perform any computational functions at all. It can be said with certainty that when you hear the term remote I/O, it only involves one controller or PLC, while distributed I/O has multiple controllers.
ZSR-Ethernet-2184 is a distributed Ethernet RTU that supports 4-way switch digital input (Di), 8-way analog input (Ai), 4-way relay (Do) output, 1-way RS485 serial port data acquisition to Ethernet, and Modbus RTU terminal. Merge 485 to Ethernet serial port server function, support Modbus to TCP/UDP protocol conversion, support virtual serial port, and interface with various configuration software. Supports signal acquisition in the range of 0-5V, 0-10V, 0-30V, or 0-20ma, 4-20ma, with built-in software and hardware watchdog, industrial grade components, and stable operation in an industrial environment of -40~85 ° C.
Building a High Channel Density Digital IO Module for the Next Generation Industrial Automation Controller
There are currently many articles introducing Industry 4.0, and smart sensors are becoming increasingly popular in factory environments (I and other authors have written about these topics). Although we have all noticed a significant increase in the use of sensors in factories, processing plants, and even some newly built automation systems, the widespread use of sensors has also brought about an important change, which is the need to handle a large amount of IO within these old controllers. These IOs may be digital or analog. This requires the construction of high-density IO modules with size and heat limitations.
Usually, digital IO in PLC consists of discrete devices such as resistors/capacitors or independent FET drives. In order to minimize the size of the controller as much as possible and to handle 2 to 4 times the number of channels, this has led to a shift from a separate approach to an integrated approach.3624 TRICONEX controller
We can use the entire article to illustrate the drawbacks of the split method, especially when the number of channels processed by each module reaches 8 or more. However, when it comes to high heat/power consumption, a large number of split components (from the perspective of size and mean time between failures (MTBF)), and the need for reliable system specifications, it is sufficient to demonstrate that the split method is not feasible.
Figure 1 shows the technical challenges faced in building high-density digital input (DI) and digital output (DO) modules. In both DI and DO systems, size and heat dissipation issues need to be considered.
Design a High Channel Density Digital Input Module
The traditional split design uses a resistive voltage divider network to convert 24V/48V signals into signals that can be used by microcontrollers. The front-end can also use discrete RC filters. If isolation is required, external optocouplers are sometimes used
For example, the current limiting value of DI devices in ADI is 3.5mA/channel. So, as shown in the figure, we use two channels in parallel. If the system must be connected to a Type 2 input, adjust the REFDI resistance and RIN resistance. For some newer components, we can also use pins or select current values through software.
To support a 48V digital input signal (not a common requirement), a similar process needs to be used, and an external resistor must be added to adjust the voltage threshold at one end of the field. Set the value of this external resistor so that the current limiting value * R+threshold of the pin meets the voltage threshold specification at one end of the field (see device data manual).
Finally, due to the connection between the digital input module and the sensor, the design must meet the requirements of reliable operating characteristics. When using a split type scheme, these protective functions must be carefully designed. When selecting integrated digital input devices, ensure that the following are determined according to industry standards:
Wide input voltage range (e.g. up to 40V).
Able to use on-site power supply (7V to 65V).
Capable of withstanding high ESD (± 15kV ESD air gap) and surges (usually 1KV).
Providing overvoltage and overheating diagnosis is also very useful for MCU to take appropriate actions.
Design a High Channel Density Digital Output Module
A typical discrete digital output design has a FET with a driving circuit driven by a microcontroller. Different methods can be used to configure FETs to drive microcontrollers.
The definition of a high-end load switch is that it is controlled by an external enable signal and connects or disconnects the power supply from a given load. Compared to low-end load switches, high-end switches provide current to the load, while low-end switches connect or disconnect the grounding connection of the load to obtain current from the load. Although they all use a single FET, the problem with low-end switches is that there may be a short circuit between the load and ground. High end switches protect the load and prevent short circuits to ground. However, the implementation cost of low-end switches is lower. Sometimes, the output driver is also configured as a push-pull switch, requiring two MOSFETs. Refer to Figure 4 below.
Integrated DO devices can integrate multiple DO channels into a single device. Due to the different FET configurations used for high-end, low-end, and push-pull switches, different devices can be used to achieve each type of output driver.
1.Has been engaged in industrial control industry for a long time, with a large number of inventories.
2.Industry leading, price advantage, quality assurance
3.Diversified models and products, and all kinds of rare and discontinued products
4.15 days free replacement for quality problems
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