Description
3564 TRICONEX nput/output communication card
3564 TRICONEX nput/output communication card
Module Clips Drive controller servo motor
Contact: Mr. Lai
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How to Build High Channel Density Digital IO Modules for the Next Generation Industrial Automation Controllers
With the rapid development of industrial automation, digital IO modules have become an indispensable part of industrial automation controllers. The digital IO module can connect the controller with external devices, such as sensors, actuators, etc., to achieve monitoring and control of industrial production processes. However, with the continuous development of industrial automation, digital IO modules need to have higher channel density and stronger functionality to meet the needs of new industrial automation controllers. Therefore, it is very important to build high channel density digital IO modules for the next generation of industrial automation controllers.
The digital IO module is one of the most fundamental modules in industrial automation controllers, and its main function is to connect the controller with external devices to achieve signal input and output. The digital IO module usually includes two parts: a digital input module and a digital output module. The digital input module can convert the digital signals of external devices into signals that the controller can read, while the digital output module can convert the digital signals output by the controller into signals that external devices can read. The channel density of a digital IO module refers to the number of digital input or digital output channels provided on the module, which is the input and output capacity of the module.
With the development of industrial automation, digital IO modules need to have higher channel density and stronger functions to meet the needs of new industrial automation controllers. The following are several aspects to consider when building a high channel density digital IO module for the next generation of industrial automation controllers:3564 TRICONEX nput/output communication card
1. Choose the appropriate communication protocol
Digital IO modules typically communicate with controllers through communication protocols, so choosing a suitable communication protocol is crucial. Common communication protocols include Modbus, Profibus, CANopen, Ethernet, etc. Different communication protocols have different advantages and disadvantages, and selecting a suitable communication protocol requires considering the following factors:
(1) Communication speed: The faster the communication speed, the shorter the response time of the digital IO module, which can process input and output signals faster.
(2) Communication distance: The farther the communication distance, the wider the application range of digital IO modules.
(3) Reliability: The reliability of communication protocols determines the stability and reliability of digital IO modules.
(4) Cost: Different communication protocols have different costs, and suitable communication protocols need to be selected based on actual needs.
2. Choose the appropriate digital IO chip
The digital IO chip is the core component of the digital IO module, and its performance and function directly affect the channel density and function of the digital IO module. Choosing a suitable digital IO chip requires considering the following factors:
(1) Channel density: The channel density of digital IO chips determines the channel density of digital IO modules, and channel density needs to be selected based on actual needs.
(2) Input/output type: Digital IO chips usually support digital input and digital output, and some chips also support functions such as analog input and output, counters, etc.
(3) Speed: The speed of the digital IO chip determines the response speed of the digital IO module, and it is necessary to choose a chip with a faster speed.
(4) Accuracy: The accuracy of digital IO chips determines the signal accuracy of digital IO modules, and it is necessary to choose chips with higher accuracy.
(5) Cost: Different digital IO chips have different costs, and suitable chips need to be selected based on actual needs.
3. Optimize circuit design
The circuit design of digital IO modules has a significant impact on their performance and stability. In order to improve the channel density and functionality of digital IO modules, it is necessary to optimize circuit design, such as:
(1) Using high-speed digital IO chips: Using high-speed digital IO chips can improve the response speed and accuracy of the module.
(2) Adopting anti-interference design: In order to improve the stability of the digital IO module, it is necessary to adopt anti-interference design, such as using filters, isolators, etc.
(3) Using optimized PCB layout: Optimizing PCB layout can reduce noise and interference in digital IO modules, improve module performance and stability.
4. Choose the appropriate shell material and size
Digital IO modules typically need to be installed in cabinets or control cabinets, so choosing the appropriate housing material and size is crucial. The shell material should have good protective and heat dissipation properties to protect the circuits of the digital IO module from external environmental influences. The shell size should be able to adapt to different installation environments, such as cabinets, control cabinets, etc.
5. Optimize software design
The software design of the digital IO module determines its functionality and performance. In order to achieve high channel density and stronger functionality, it is necessary to optimize software design, such as:
(1) Supporting multiple input and output types: Supporting multiple input and output types can meet different application needs, such as digital input and output, analog input and output, counters, etc.
(2) Supporting multiple communication protocols: Supporting multiple communication protocols can adapt to different controllers and application environments.
(3) Support for online debugging and monitoring: Supporting online debugging and monitoring can facilitate user diagnosis and maintenance of modules.
(4) Support for expansion function: Supporting expansion function can increase the functionality and application range of the module while ensuring channel density.
In summary, building a high channel density digital IO module for the next generation of industrial automation controllers requires multiple considerations, including selecting suitable communication protocols, selecting suitable digital IO chips, optimizing circuit design, selecting suitable shell materials and sizes, and optimizing software design. Only by comprehensively considering these factors can a digital IO module with high channel density and stronger functionality be constructed to meet the needs of new industrial automation controllers.
How to assign IO devices to IO controllers?
PROFINET IO system
The PROFINET IO system consists of a PROFINET IO controller and its assigned PROFINET IO devices. After adding IO controllers and IO devices, it is necessary to assign IO controllers to the IO devices to form a basic PROFINET IO system.
Prerequisite requirements
● Already in the network view of STEP 7.
A CPU has been placed (e.g. CPU 1516-3 PN/DP).
● An IO device has been placed (e.g. IM 155-6 PN ST)
Operating Steps (Method 1)
To assign IO devices to IO controllers, follow these steps:
1. Move the mouse pointer over the interface of the IO device.
2. Hold down the left mouse button.
3. Drag the mouse pointer.
The pointer will now use the networking symbol to indicate the “networking” mode. At the same time, you can see a lock character appearing on the pointer
Number. The lock symbol only disappears when the pointer moves to a valid target position.
4. Now, move the pointer to the interface of the desired IO controller and release the left mouse button.
5. Now assign the IO device to the IO controller.
Operating Steps (Method 2)
To assign IO devices to IO controllers, follow these steps:
1. Move the mouse pointer over the word “Unassigned” in the bottom left corner of the IO device icon.
2. Click the left mouse button.
3. Select the IO controller interface to be connected from the available interfaces that appear.
4. Now assign the IO device to the IO controller.
What IO combinations can a mini PLC combine with to achieve automated control?
At present, there are two main design modes for controllers like PLC, one is integrated design and the other is modular design. From the name, we can feel that there are two different PLCs, one that cannot be disassembled and the other that can be disassembled. Due to the fact that the main control module and IO module of the modular PLC can be spliced as needed, its volume and weight are usually very small, and we cannot call it a mini PLC too much. So, what IO combinations can such a small gadget combine with to achieve automation control? Let”s take a brief inventory:3564 TRICONEX nput/output communication card
1. Firstly, there is the digital quantity acquisition IO module, which is used to collect digital quantity information. Typical examples include counter IO, PNP type digital quantity acquisition IO, NPN type digital quantity acquisition IO, etc.
2. Then there is the digital output IO module, which is used to send digital instructions. The most typical example is PWM output IO, which can output pulse signals to control servo motors or stepper motors for operation.
3. After talking about digital IO, let”s talk about analog IO. Analog signal acquisition type IO includes voltage signal acquisition, current signal acquisition, and temperature signal acquisition. The IO for collecting temperature signals includes PT100, PT1000, and various thermocouple temperature acquisition modules.
4. Finally, there are analog output IO, as well as output current signals and voltage signals.
In addition to the above IO modules, our modular PLC also supports extended communication interfaces, further enhancing the equipment”s scalability.
Module Input/Output (I/O) Knowledge3564 TRICONEX nput/output communication card
Module Input/Output (I/O) Knowledge
I think it”s necessary to talk about the sorting of the input and output ports of the module. Generally, we can divide it into IO functional division and IO specifications.
The purpose of the former is mainly to convert all functions into actual division into MCU IO ports, while the purpose of the latter is to determine the specifications of all IO ports. Of course, you can completely skip these tasks, and it”s also possible. Depending on the company”s requirements, I think individuals still consider them as a work habit.
The following examples are all created for my blog post. If there are any duplicate names, please do not contact me.
Looking at the above figure, first determine all input and output functions and power input, as well as communication.
Then separate the power distribution with different lines, and start organizing each power supply line and processing process. The final purpose of the entire diagram is to clearly allocate the input and output sequence.
The IO specification is to provide a detailed description of all interfaces, crystal oscillators, and other information to the MCU.
1. Enter the number of low effective interfaces and how much pull-up resistance (switch wet current) is required (how much current does the microcontroller need to absorb, which may be injected into the microcontroller after pull-up).
2. Enter the number of highly effective interfaces, how many pull-down resistors are required (switch wet current), (how much current does the microcontroller need to absorb, and it is possible to inject the microcontroller after the switch is effective)
3. Number of analog input interfaces, evaluate whether the analog ports of the microcontroller are sufficient, and confirm the required analog conversion accuracy. Evaluate whether the A/D conversion reference voltage needs to be replaced (to meet accuracy requirements). Consider how many power supplies need to be tested and how many analog input ports are configured.
4. Evaluate the requirements for crystal oscillator accuracy and whether a phase-locked loop is required.
The above requirements are mainly aimed at module design and need to be confirmed during the early development of the module. All requirements can be organized using an Excel table and displayed in the diagram.
Distributed dual Ethernet IO module
The distributed dual Ethernet IO module adopts an industrial grade design, which meets the demanding industrial application scenarios. It is equipped with a dedicated high-performance Ethernet chip, which can quickly achieve cascade networking between IO modules without the need for repeated wiring, saving on-site wiring costs.
The distributed dual Ethernet IO module comes with switch input, switch output, relay output, analog input, analog input, thermal resistance input, etc. It supports high-speed pulse input counting and high-speed pulse output, and is designed specifically for industrial field data collection, measurement, and control. The distributed dual Ethernet IO module supports Modbus TCP protocol and Modbus RTU protocol for uplink, which can quickly connect to existing DCS, SCADA, PLC, HMI and other systems. The distributed dual Ethernet IO module supports one RS485 interface and supports Modbus RTU Master function. It can expand the IO module, read and write intelligent instrument data, or connect to HMI, DCS, PLC and other devices as a Modbus Slave.
What are the characteristics of a demonstration system based on IO Link slave stations
IO Link is an industrial communication interface that is independent of any fieldbus and suitable for simple sensors and actuators at the lowest level of industrial control. The IO Link system includes IO Link devices (such as sensors and actuators), IO Link master stations, and cables for standard sensors. The system structure is shown in Figure 1. For example, when a remote IO module compatible with EtherNet/IP serves as the master station, in addition to standard I/O signals, the module sends and receives configuration data, diagnostic data, or enhanced process data through a pulse modulation process, which is then packaged into EtherNet/IP data packets and finally transmitted to the network master station, usually a PLC. In the above applications, the connection between remote I/O and IO Link devices remains the same as that of traditional discrete devices. The advantage of IO Link mainly lies in its greater information exchange capability, which was previously impossible to achieve with standard I/O devices. Another advantage of IO Link is that it does not rely on any fieldbus, and through any I/O module that complies with the IO Link protocol (including local I/O and remote I/O), IO Link sensors or actuators can be integrated into any fieldbus system.
In order to further study the architecture, communication mechanism, and development application of the IO Link system, an IO Link slave toolkit can be designed and developed, including a universal development module for IO Link, an IO Link analysis tool, and an IO Link slave protocol stack. The IO Link universal development module is the foundation for this work and also serves as a bridge between the IO Link master station and equipment signals. The IO Link analysis tool can help developers and testers analyze communication details to identify and solve problems. The IO Link slave protocol stack is a firmware library that provides a hardware abstraction layer and application program interface, allowing developers to easily and quickly develop IO Link slave products on various microprocessor platforms. The IO Link slave station studied in this article only focuses on digital (button) signal input and digital signal output (indicator light). The design of the IO Link universal development module only needs to be expanded on this basis to have the ability to process analog signals.
The IO Link Master module used in this article, USB IO Link Master, can connect IO Link devices to a PC, which can be configured and tested through the IO Link Device Tool software or demonstrated device functionality. IO Link devices must be described through a device description file (IODD file), which includes a set of XML text files and PNG graphic files, which contain information about device identification, communication characteristics, parameters, process data, and diagnostic data. The portion within the elliptical dashed line in Figure 2 is an IO Link three wire cable, with L+/I – being a 24 V DC power supply and C/Q being a signal line used to transmit process data, diagnostic data, configuration data, etc. The IO Link universal development module is mainly composed of data transceivers and microprocessors. It can process input signals from sensors and transmit information to the IO Link master station. It can also receive and process data information from the master station and transmit it to the actuator. The IO Link analysis tool can help developers view, record, analyze data, and understand communication details. This part of the design is not discussed in this article.
Introduction to IO Link Communication Mode3564 TRICONEX nput/output communication card
IO Link devices can operate in SIO mode (standard I/O mode) or IO Link mode (communication mode). After power on, the device always operates in SIO mode. The port of the main station has different configuration methods. If configured in SIO mode, the main station considers the port as a standard digital input. If configured in communication mode, the main station will automatically identify the communicable devices for communication.
2.1 Data Types3564 TRICONEX nput/output communication card
The three basic data types for IO Link communication are periodic data (or process data PD), non periodic data (or service data SD), and event.
The process data (PD) of the device is transmitted periodically in the form of a data frame, while service data (SD) is only exchanged after the master station issues a request. Figure 3 shows a typical IO Link message structure. When an event occurs, the “event flag” of the device is set, and the main station reads the reported event (service data cannot be exchanged during the reading process) upon detecting the setting. Therefore, events such as pollution, overheating, short circuits, or device status can be transmitted to the PLC or visualization software through the main station
2.2 Parameter data exchange
Since service data (SD) must be transmitted through PLC requests, SPDU (Service Protocol Data Unit) is defined. In the main station, requests for read and write services are written to SPDU and transmitted to devices through the IO Link interface.
The general structure of SPDU is shown in Figure 4, and its arrangement order is consistent with the transmission order. The elements in SPDU can take different forms depending on the type of service. SPDU allows access to data objects that are intended for transmission, while Index is used to specify the address of the requested data object on the remote IO Link device. In IO Link, there is a term called direct parameter page, which stores parameter information such as minimum cycle time, supplier ID, and master station commands. The data objects accessible in the direct parameter page can be selectively provided through SPDU.
HMT7742 is an IO Link slave transceiver chip that serves as a bridge between the MCU of external sensors or actuators and the 24V signal line that supports IO Link communication. When the IO Link device is connected to the master station, the master station initializes communication and exchanges data with the MCU. HMT7742 serves as the physical layer for communication.
Due to the fact that the three indicator lights (rated voltage 24 V) controlled by the output port of the MCU are powered by the IO Link power cord, it is necessary to monitor the current on the power cord in order to trigger appropriate corrective measures when the current exceeds a set threshold, such as removing the indicator lights from the IO Link power cord. The current monitoring module uses an INA194 current detection amplifier. As a high detection current detector, INA194 is directly connected to the power supply and can detect all downstream faults. It has a very high common mode rejection ratio, as well as a large bandwidth and response speed. It can amplify the voltage on the induction resistor 5O times and output it to the forward input terminal AIN0 of the MCU internal voltage comparator. When the voltage value of AIN0 exceeds the threshold set at the reverse input terminal, By controlling the low level output of PB0, the indicator LAMP can be cut off from the IO Link power line to achieve overcurrent protection function. This part of the circuit is shown in Figure 6.
Application of Data Acquisition IO Module in Thermal Power Plant System3564 TRICONEX nput/output communication card
The Ethernet IO module is a data acquisition and control device. It uses Ethernet as a communication method to transmit data from various industrial control sensors and actuators to computers or other devices for management and monitoring. As a modern energy supply base, thermal power plants need to widely apply various intelligent control technologies to improve operational efficiency, reduce costs, and improve safety. In this context, the application of barium rhenium Ethernet IO modules is particularly important.
In the application of thermal power plants, the main function of the barium rhenium Ethernet IO module is to achieve real-time monitoring and control of the production process. By connecting to various sensors and actuators, the barium rhenium Ethernet IO module can collect real-time environmental parameters, machine operation status, and other data of the thermal power plant. By analyzing and processing these data, commanders can understand the operation of the thermal power plant and make corresponding adjustments. Compared to traditional automatic control systems, the barium rhenium Ethernet IO module has the advantages of stronger flexibility, faster reaction speed, and higher accuracy, which can greatly improve the operational efficiency and reliability of thermal power plants.
The real-time monitoring and control of thermal power plants require many capabilities of barium rhenium Ethernet IO modules. Here are several common application scenarios:
Firstly, the barium rhenium module can monitor parameters such as gas flow and water flow in thermal power plants. These parameters are crucial for ensuring the normal operation of the thermal power plant. Once these parameters undergo abnormal changes, the DO channel can be connected to the barium rhenium Ethernet IO module, and the alarm signal will immediately sound to remind the command personnel to handle it. Meanwhile, due to the fact that the barium rhenium Ethernet IO module can collect these data in real-time and transmit it to the monitoring system for recording, it can provide better technical support for quality management in thermal power plants.
Secondly, the barium rhenium Ethernet IO module can also monitor the operating status of mechanical equipment in thermal power plants. This includes parameters such as temperature, pressure, vibration, etc. By monitoring and analyzing these parameters, the barium rhenium Ethernet IO module can detect machine equipment faults in a timely manner, thereby avoiding the expansion of losses. In addition, during machine equipment maintenance, historical data recorded by the barium rhenium Ethernet IO module can be used to develop more scientific and reasonable maintenance plans, reduce maintenance costs, and improve maintenance efficiency.
Finally, the barium rhenium Ethernet IO module can also help thermal power plants achieve distributed control. We can remotely control and monitor multiple areas of the thermal power plant by connecting multiple barium rhenium modules to a network. This not only reduces the on-site debugging of equipment, but also strengthens the evaluation of equipment reliability.
In summary, the barium rhenium Ethernet IO module has unique advantages in real-time monitoring and control of thermal power plants. It can help command personnel monitor machine data in real-time, discover abnormal information, take timely measures to avoid impacts, and improve production efficiency and safety.
Remote IO modules based on Ethernet communication are widely used in the field of industrial IoT
With the development of IIOT (Industrial IOT) industrial Internet of Things technology, many traditional assets need to be connected to the internet to achieve unified data collection, analysis, processing, and storage, breaking the traditional phenomenon of device information silos. Therefore, the MQTT Ethernet IO acquisition module M160T, which supports the Internet of Things protocol, is able to unleash its potential by being compatible with existing devices and able to connect to IoT platforms. The MQTT Ethernet IO acquisition module will be widely used in industrial IoT, such as smart property, smart parks, smart factories, smart transportation, smart water conservancy, smart agriculture, smart campuses, smart communities, smart distribution, smart water conservancy, and many other industries.
Ethernet communication technology is a mature communication technology that has been widely applied. Therefore, Ethernet communication is the first choice for enterprises to connect various assets to the Internet of Things platform. Its reasons are stable and reliable, mature technology, fast transmission speed, and fast construction wiring.3564 TRICONEX nput/output communication card
For traditional various assets, such as low-voltage distribution rooms, air compressor rooms, property and living pump rooms, street light control, liquid level collection, temperature and humidity collection, etc., through the MQTT Ethernet IO collection module, they can be quickly connected to the Internet of Things platform.
So, what characteristics do MQTT Ethernet IO modules need to have when used in IoT solutions? The details are as follows:
1. Actively connect to cloud platforms:
Based on the characteristics of Ethernet communication networking, the Ethernet IO acquisition module must support the TCP Client function, which is not only the TCP client function, so that the Ethernet IO module can actively connect to the IoT platform without the need for complex settings such as peanut shells;
2. Compatible with existing systems:
Support TCP Server and Modbus TCP protocol functions, which can be compatible with traditional upper computer systems or device access of HMI”s TCP client;
3. Access to IoT platforms:
Supports standard MQTT protocol and Modbus TCP protocol, and can be connected to various MQTT protocol IoT platforms such as Huawei Cloud and Alibaba Cloud, or traditional SCADA and DCS systems;
4. Rich IO interfaces and scalability:
There are various types of data to be collected on site, and it is necessary to support the collection of various devices such as 4-20Ma, RS485, DI, DO, etc. At the same time, it is also necessary to have the ability to read RS485 device instrument data or expand the functions of the IO acquisition module;
5. Easy installation method:
The volume of the control box is very limited, so it is necessary to use directly inserted and unplugged wiring terminals, as well as a rail installation method.
6. Industrial grade design
The industrial environment is harsh, and the Ethernet IO module must adopt an industrial grade design to ensure continuous and stable operation in harsh environments.
Through the MQTT Ethernet IO acquisition module, there is no need to replace various existing enterprise assets and the digital transformation of accessing IoT platforms can be quickly achieved. Therefore, the MQTT Ethernet IO acquisition module will be widely used in industrial IoT, such as smart properties, smart parks, smart factories, smart transportation, smart water conservancy, smart agriculture, smart campuses, smart communities, smart power distribution, smart water conservancy, and many other industries.
What exactly does embedded development do?
Embedded development is a technology similar to programming, but our understanding of the scope of programmers is to do computer software, web development, and also to do apps.
The majority of embedded development is intelligent electronic products, which are designed for hardware programming. This hardware can be understood as a circuit board, usually composed of a controller (processor) chip and different circuits.
The specific program and circuit are generally determined by the product function. For example, an electronic clock product is usually composed of a digital tube and a microcontroller (controller), and then written in C language to download it to the microcontroller to achieve clock display.3564 TRICONEX nput/output communication card
Of course, there are far more products that can be developed in embedded systems, including smartphones, wearable devices, drones, robots, mice and keyboards, and so on.
The knowledge system of embedded development and design is also very diverse, and different products require different learning contents.
So, if we want to enter embedded development, we must first understand several directions of embedded development, otherwise you will never find a starting point.
The general mainstream directions are microcontroller development, ARM+Linux development, and FPGA/DSP development.
I have been working on microcontroller development for the past 10 years of my career.
Microcontrollers can be said to be the foundation of all directions. If you have strong microcontroller development capabilities, then ARM+Linux, or FPGA/DSP are easy for you to get started.
The development of microcontrollers is also one of the directions with the lowest threshold for embedded systems. Initially, I was self-taught in electrical engineering and transferred there. It took me about four months from the beginning of my studies to finding a job.
However, at that time, the threshold was still very low, and you could basically find a job by working on a small project with a 51 microcontroller.
If it”s the current situation, you only know these things and have little competitiveness. Nowadays, the main focus of enterprises is on whether you have project experience, rather than what kind of microcontroller you know.
The project experience can be accumulated through practical projects with endless microcontroller programming, which can be said to be the closest to actual development at present.
At present, the salary of single-chip microcontrollers is not low, and it is normal for them to start at 8K in first tier cities, and they can reach 15K after working for 2-3 years.
There are many industries covered by embedded systems, and in the later stage, based on work, we will only focus on one direction. From a macro perspective, we will divide it into embedded software development and embedded hardware development. Software development is mainly based on application software development on systems (Linux, VxWorks, WinCE, etc.), and hardware development includes motherboard design, system porting, cutting, and writing low-level drivers
My personal experience started with microcontrollers. Firstly, I studied C and C++, digital and analog electronics, power electronics, circuit design, microcontroller principles, FreeRTOS, data structures, and computer operating systems. Later, due to work requirements, I relearned university automation control theory, signals and systems, complex functions, linear algebra, calculus, statistics, and compiler principles. These are all basics, and it is important to understand and thoroughly study them, This will bring help to the later research and development work, and there is also a need for more drawing board, drawing board, and practical operation. Without practicing optics, the efficiency is very low, and knowledge is repetitive. Only by repeatedly looking and using can we understand. We can buy some development boards to assist in learning. Now that the internet is developed, network resources can improve our learning efficiency.
Embedded development refers to developing under an embedded operating system, commonly used systems include WinCE, ucos, vxworks, Linux, Android, etc. In addition, develop using C, C++, or assembly; Using advanced processors such as arm7, arm9, arm11, powerpc, mips, mipsel, or operating systems also belongs to embedded development.
1. Basic knowledge:
Purpose: I can understand the working principles of hardware, but the focus is on embedded software, especially operating system level software, which will be my advantage.
Subjects: Digital Circuits, Principles of Computer Composition, and Embedded Microprocessor Architecture.
Assembly Language, C/C++, Compilation Principles, Discrete Mathematics.
Data structure and algorithms, operating systems, software engineering, networks, databases.
Method: Although there are many subjects, they are all relatively simple foundations and most of them have been mastered. Not all courses may be taught, but elective courses can be taken as needed.
Main books: The C++programming language (I haven”t had time to read it), Data Structure-C2.
2. Learning Linux:
Purpose: To gain a deeper understanding of the Linux system.
Method: Using Linux ->Linxu system programming development ->Driver development and analysis of the Linux kernel. Let”s take a closer look, then the main topic is principles. After reading it a few times, look at the scenario analysis and compare it deeply. The two books intersect, with depth being the outline and emotion being the purpose. Analysis is version 0.11, suitable for learning. Finally, delve into the code.
Main books: Complete Analysis of Linux Kernel, Advanced Programming in Unix Environment, Deep Understanding of Linux Kernel, Scenario Analysis, and Source Generation.
3. Learning embedded Linux:
Purpose: To master embedded processors and their systems.
Method: (1) Embedded microprocessor structure and application: Direct arm principle and assembly are sufficient, without repeating x86.
(2) Embedded operating system class: ucOS/II is simple, open source, and easy to get started. Then delve deeper into uClinux.
(3) Must have a development board (arm9 or above) and have the opportunity to participate in training (fast progress, able to meet some friends).
Main books: Mao Decao”s “Embedded Systems” and other arm9 manuals and arm assembly instructions.
1.Has been engaged in industrial control industry for a long time, with a large number of inventories.
2.Industry leading, price advantage, quality assurance
3.Diversified models and products, and all kinds of rare and discontinued products
4.15 days free replacement for quality problems
ABB — AC 800M controller, Bailey, PM866 controller, IGCT silicon controlled 5SHY 3BHB01 3BHE00 3HNA00 DSQC series
BENTLY — 3500 system/proximitor, front and rear card, sensor, probe, cable 3500/20 3500/61 3500/05-01-02-00-001 3500/40M 176449-01 3500/22M 138607-01
Emerson — modbus card, power panel, controller, power supply, base, power module, switch 1C31,5X00, CE400, A6500-UM, SE3008,1B300,1X00,
EPRO — PR6423 PR6424 PR6425 PR6426 PR9376 PR9268 Data acquisition module, probe, speed sensor, vibration sensor
FOXBORO — FCP270 FCP280 FCM10EF FBM207 P0914TD CP40B FBI10E FBM02 FBM202 FBM207B P0400HE Thermal resistance input/output module, power module, communication module, cable, controller, switch
GE —- IS200/215/220/230/420 DS200/215 IC693/695/697/698 VMICPCI VMIVME 369-HI-R-M-0-0-E 469 module, air switch, I/O module, display, CPU module, power module, converter, CPU board, Ethernet module, integrated protection device, power module, gas turbine card
HIMA — F3 AIO 8/4 01 F3231 F8627X Z7116 F8621A 984862160 F3236 F6217 F7553 DI module, processor module, AI card, pulse encoder
Honeywell — Secure digital output card, program module, analog input card, CPU module, FIM card
MOOG — D136-001-007 Servo valve, controller, module
NI — SCXI-1100 PCI – PXIE – PCIE – SBRIO – CFP-AO-210 USB-6525 Information Acquisition Card, PXI Module, Card
Westinghouse — RTD thermal resistance input module, AI/AO/DI/DO module, power module, control module, base module
Woodward — 9907-164 5466-258 8200-1300 9907-149 9907-838 EASYGEN-3500-5/P2 8440-2145 Regulator, module, controller, governor
YOKOGAWA – Servo module, control cabinet node unit
Main products:
PLC, DCS, CPU module, communication module, input/output module (AI/AO/DI/DO), power module, silicon controlled module, terminal module, PXI module, servo drive, servo motor, industrial display screen, industrial keyboard, controller, encoder, regulator, sensor, I/O board, counting board, optical fiber interface board, acquisition card, gas turbine card, FIM card and other automatic spare parts
