Description
3502E Safety Instrumented System (SIS)
3502E Safety Instrumented System (SIS)
Module Clips Drive controller servo motor
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What are the characteristics of a demonstration system based on IO Link slave stations
IO Link is an industrial communication interface that is independent of any fieldbus and suitable for simple sensors and actuators at the lowest level of industrial control. The IO Link system includes IO Link devices (such as sensors and actuators), IO Link master stations, and cables for standard sensors. The system structure is shown in Figure 1. For example, when a remote IO module compatible with EtherNet/IP serves as the master station, in addition to standard I/O signals, the module sends and receives configuration data, diagnostic data, or enhanced process data through a pulse modulation process, which is then packaged into EtherNet/IP data packets and finally transmitted to the network master station, usually a PLC. In the above applications, the connection between remote I/O and IO Link devices remains the same as that of traditional discrete devices. The advantage of IO Link mainly lies in its greater information exchange capability, which was previously impossible to achieve with standard I/O devices. Another advantage of IO Link is that it does not rely on any fieldbus, and through any I/O module that complies with the IO Link protocol (including local I/O and remote I/O), IO Link sensors or actuators can be integrated into any fieldbus system.
In order to further study the architecture, communication mechanism, and development application of the IO Link system, an IO Link slave toolkit can be designed and developed, including a universal development module for IO Link, an IO Link analysis tool, and an IO Link slave protocol stack. The IO Link universal development module is the foundation for this work and also serves as a bridge between the IO Link master station and equipment signals. The IO Link analysis tool can help developers and testers analyze communication details to identify and solve problems. The IO Link slave protocol stack is a firmware library that provides a hardware abstraction layer and application program interface, allowing developers to easily and quickly develop IO Link slave products on various microprocessor platforms. The IO Link slave station studied in this article only focuses on digital (button) signal input and digital signal output (indicator light). The design of the IO Link universal development module only needs to be expanded on this basis to have the ability to process analog signals.
The IO Link Master module used in this article, USB IO Link Master, can connect IO Link devices to a PC, which can be configured and tested through the IO Link Device Tool software or demonstrated device functionality. IO Link devices must be described through a device description file (IODD file), which includes a set of XML text files and PNG graphic files, which contain information about device identification, communication characteristics, parameters, process data, and diagnostic data. The portion within the elliptical dashed line in Figure 2 is an IO Link three wire cable, with L+/I – being a 24 V DC power supply and C/Q being a signal line used to transmit process data, diagnostic data, configuration data, etc. The IO Link universal development module is mainly composed of data transceivers and microprocessors. It can process input signals from sensors and transmit information to the IO Link master station. It can also receive and process data information from the master station and transmit it to the actuator. The IO Link analysis tool can help developers view, record, analyze data, and understand communication details. This part of the design is not discussed in this article.
Introduction to IO Link Communication Mode3502E Safety Instrumented System (SIS)
IO Link devices can operate in SIO mode (standard I/O mode) or IO Link mode (communication mode). After power on, the device always operates in SIO mode. The port of the main station has different configuration methods. If configured in SIO mode, the main station considers the port as a standard digital input. If configured in communication mode, the main station will automatically identify the communicable devices for communication.
2.1 Data Types3502E Safety Instrumented System (SIS)
The three basic data types for IO Link communication are periodic data (or process data PD), non periodic data (or service data SD), and event.
The process data (PD) of the device is transmitted periodically in the form of a data frame, while service data (SD) is only exchanged after the master station issues a request. Figure 3 shows a typical IO Link message structure. When an event occurs, the “event flag” of the device is set, and the main station reads the reported event (service data cannot be exchanged during the reading process) upon detecting the setting. Therefore, events such as pollution, overheating, short circuits, or device status can be transmitted to the PLC or visualization software through the main station
2.2 Parameter data exchange
Since service data (SD) must be transmitted through PLC requests, SPDU (Service Protocol Data Unit) is defined. In the main station, requests for read and write services are written to SPDU and transmitted to devices through the IO Link interface.
The general structure of SPDU is shown in Figure 4, and its arrangement order is consistent with the transmission order. The elements in SPDU can take different forms depending on the type of service. SPDU allows access to data objects that are intended for transmission, while Index is used to specify the address of the requested data object on the remote IO Link device. In IO Link, there is a term called direct parameter page, which stores parameter information such as minimum cycle time, supplier ID, and master station commands. The data objects accessible in the direct parameter page can be selectively provided through SPDU.
HMT7742 is an IO Link slave transceiver chip that serves as a bridge between the MCU of external sensors or actuators and the 24V signal line that supports IO Link communication. When the IO Link device is connected to the master station, the master station initializes communication and exchanges data with the MCU. HMT7742 serves as the physical layer for communication.
Due to the fact that the three indicator lights (rated voltage 24 V) controlled by the output port of the MCU are powered by the IO Link power cord, it is necessary to monitor the current on the power cord in order to trigger appropriate corrective measures when the current exceeds a set threshold, such as removing the indicator lights from the IO Link power cord. The current monitoring module uses an INA194 current detection amplifier. As a high detection current detector, INA194 is directly connected to the power supply and can detect all downstream faults. It has a very high common mode rejection ratio, as well as a large bandwidth and response speed. It can amplify the voltage on the induction resistor 5O times and output it to the forward input terminal AIN0 of the MCU internal voltage comparator. When the voltage value of AIN0 exceeds the threshold set at the reverse input terminal, By controlling the low level output of PB0, the indicator LAMP can be cut off from the IO Link power line to achieve overcurrent protection function. This part of the circuit is shown in Figure 6.
Application Scheme of Industrial Ethernet Remote IO Module in Intelligent Manufacturing Workshop
With the advent of Industry 4.0, intelligent manufacturing has become a trend in industrial production. Intelligent manufacturing requires efficient, stable, and reliable industrial Ethernet remote IO modules to monitor the production process. This article will share an application case of an intelligent manufacturing workshop based on industrial Ethernet remote IO module.3502E Safety Instrumented System (SIS)
The production process of this intelligent manufacturing workshop is mainly divided into two parts: injection molding and automated assembly. The injection molding process requires controlling parameters such as the melting temperature of the melt, the speed and pressure of the injection molding machine. The automated assembly process requires controlling the actions of the assembly robot and detecting the quality of the product. In addition to these production process data, there are also equipment production data such as daily and weekly production in the workshop, as well as equipment status data such as operation, manual, automatic, mold adjustment, and alarm.
In the past, the production process of the factory mainly relied on traditional hard wiring to control the production process, resulting in low work efficiency due to the need for frequent replacement of transmission lines to meet production needs. Moreover, it is very difficult to collect a large number of types of detection and monitoring data for intelligent manufacturing. In order to improve efficiency, production quality, and reliability, the factory has introduced the industrial Ethernet remote IO module MxxT using barium rhenium technology.
The injection molding machine itself comes with MODBUS industrial control bus data or basic status signal output. The barium rhenium technology remote IO module collects data from the device interface RS232/RS485 port, collects status information of the injection molding machine such as startup, operation, and pause, and uploads it to the injection molding machine controller, or wirelessly uploads it to the cloud server. Based on devices, according to the communication protocols and interfaces of different devices, data is obtained by calling their interface channels, and then transmitted to the server.
The remote IO module is connected to the controller of the injection molding machine, and the operation data of the injection molding machine is uploaded and distributed wirelessly, achieving remote monitoring and intelligent control of the injection molding machine. In addition, the remote I/O module supports perceptual access to peripheral devices such as mold temperature machines, cutting machines, and dryers for injection molding machines, providing users with smart factory services.
During the injection molding process, the industrial Ethernet remote IO module transmits real-3502E Safety Instrumented System (SIS)time data such as temperature, pressure, and speed to the main controller for monitoring and adjustment, ensuring the stability and compliance of production parameters under different conditions. In the automated assembly process, the industrial Ethernet remote IO module collects data through sensors and other devices, and transmits the relevant data to the main controller for adjustment of relevant actions. For example, the industrial Ethernet remote IO module can monitor the actions of assembly robots, detect the accuracy of product assembly and product quality, and ensure the production quality and stability of the product. At the same time, all production data can also be collected and analyzed remotely, helping enterprise managers better monitor production efficiency and quality.
By introducing industrial Ethernet remote IO modules, this intelligent manufacturing workshop not only improves production efficiency and stability, but also reduces labor and energy costs. Because the industrial Ethernet remote IO module can help enterprises complete the collection and monitoring of production data with one click, as well as avoid unnecessary line replacement and the need for workers to enter and exit the production process, thereby reducing costs and improving production efficiency for enterprises.
In summary, the application of industrial Ethernet remote IO modules in intelligent manufacturing workshops not only improves production efficiency and quality, reduces costs, but also achieves intelligent and digital management of production processes, bringing more opportunities and development space for enterprise development.
In addition, this device is widely used for networking and data collection of industrial equipment such as injection molding machines, air compressors, CNC machine tools, on-site PLCs, instruments, sensors, CNC, and electromechanical equipment.
Building a High Channel Density Digital IO Module for the Next Generation Industrial Automation Controller
There are currently many articles introducing Industry 4.0, and smart sensors are becoming increasingly popular in factory environments (I and other authors have written about these topics). Although we have all noticed a significant increase in the use of sensors in factories, processing plants, and even some newly built automation systems, the widespread use of sensors has also brought about an important change, which is the need to handle a large amount of IO within these old controllers. These IOs may be digital or analog. This requires the construction of high-density IO modules with size and heat limitations. In this article, I will focus on digital IO, and in subsequent articles, I will introduce analog IO.
Usually, digital IO in PLC consists of discrete devices such as resistors/capacitors or independent FET drives. In order to minimize the size of the controller as much as possible and to handle 2 to 4 times the number of channels, this has led to a shift from a separate approach to an integrated approach.
We can use the entire article to illustrate the drawbacks of the split method, especially when the number of channels processed by each module reaches 8 or more. However, when it comes to high heat/power consumption, a large number of split components (from the perspective of size and mean time between failures (MTBF)), and the need for reliable system specifications, it is sufficient to demonstrate that the split method is not feasible.
Figure 1 shows the technical challenges faced in building high-density digital input (DI) and digital output (DO) modules. In both Di and DO systems, size and heat dissipation issues need to be considered.
Digital input
size
heat
Supports all input types
Type 1, 2, 3, Input
Supports 24 V and 48 V inputs
Robust operating specifications
Wire breakage detection
Digital output
Support for different types of output driver configurations
size
Integrated demagnetization of inductive loads
Heat – When driving multiple outputs
Drive accuracy
diagnosis
For digital input, it is also important to note that it supports different input types, including 1/2/3 type inputs, and in some cases, 24V and 48V inputs. In all cases, reliable operating characteristics are crucial, and sometimes circuit detection is also crucial.
For digital outputs, the system uses different FET configurations to drive the load. The accuracy of the driving current is usually an important consideration. In many cases, diagnosis is also very important.
We will explore how integrated solutions can help address some of these challenges.
Design a High Channel Density Digital Input Module
The traditional split design uses a resistive voltage divider network to convert 24V/48V signals into signals that can be used by microcontrollers. The front-end can also use discrete RC filters. If isolation is required, external optocouplers are sometimes used.
Figure 1 shows a typical discrete method for constructing digital input circuits.
Figure 1. Considerations for digital input and output modules.
This type of design is suitable for a certain number of digital inputs; 4 to 8 per board. Beyond this number, this design will soon become impractical. This separation scheme can bring various problems, including:
High power consumption and related board high temperature points.
Each channel requires an optocoupler.
Excessive components can lead to low FIT rate and even require larger devices.
More importantly, the split design method means that the input current increases linearly with the input voltage. Assuming a 2.2K Ω input resistor and 24V V is used. When the input is 1, for example, at 24V, the input current is 11mA, which is equivalent to a power consumption of 264mW. The power consumption of the 8-channel module is greater than 2W, and the power consumption of the 32-bit module is greater than 8W. Refer to Figure 3 below
From a cooling perspective alone, this split design cannot support multiple channels on a single board.
One of the biggest advantages of integrated digital input design is the significant reduction in power consumption, thereby reducing heat dissipation. Most integrated digital input devices allow configurable input current limitations to significantly reduce power consumption.
When the current limiting value is set to 2.6mA, the power consumption is significantly reduced, with each channel approximately 60mW. The rated value of the 8-channel digital input module can now be set below 0.5
Another reason for opposing the use of split logic design is that sometimes DI modules must support different types of inputs. The standard 24V digital input specifications published by IEC are divided into Type 1, Type 2, and Type 3. Type 1 and Type 3 are usually used in combination because their current and threshold limits are very similar. Type 2 has a current limit of 6mA, which is higher. When using the split method, it may be necessary to redesign as most discrete values need to be updated.
However, integrated digital input products typically support all three types. Essentially, Type 1 and Type 3 are generally supported by integrated digital input devices. However, in order to meet the minimum current requirement of 6mA for Type 2 input, we need to use two channels in parallel for one field input. And only adjust the current limiting resistance. This requires a circuit board change, but the change is minimal.
What is the difference between remote IO and distributed IO
People often discuss the difference between remote IO and distributed IO. However, some people believe that they are the same and terms can be exchanged, while others believe the opposite. What is the difference between remote I/O and distributed I/O? The following is a guide from remote IO manufacturer Zhongshan Technology to understand the difference between remote IO and distributed IO.
Remote and distributed within the location range.3502E Safety Instrumented System (SIS)
Today”s DCS is a control system with many distributed autonomous controllers, each with many continuous operations. This controller is bundled together by a central monitoring controller. We have used the terms remote and distributed in the locations of I/O and controllers. It is easy to see how these terms are misunderstood.
From the perspective of PLC, remote I/O represents the actual distance that the I/O module is away from the control PLC. Distributed I/O is very intelligent, as mentioned earlier, remote I/O is sometimes referred to as distributed I/O. Let”s take a look at the definition of distributed I/O. This definition is different from remote I/O.
Generally speaking, distributed I/O has a brain or some computing power. By default, it is remote. As mentioned earlier, remote I/O is located physically far from the control PLC. Remote I/O has no brain and cannot perform any computational functions at all. It can be said with certainty that when you hear the term remote I/O, it only involves one controller or PLC, while distributed I/O has multiple controllers.
ZSR-Ethernet-2184 is a distributed Ethernet RTU that supports 4-way switch digital input (Di), 8-way analog input (Ai), 4-way relay (Do) output, 1-way RS485 serial port data acquisition to Ethernet, and Modbus RTU terminal. Merge 485 to Ethernet serial port server function, support Modbus to TCP/UDP protocol conversion, support virtual serial port, and interface with various configuration software. Supports signal acquisition in the range of 0-5V, 0-10V, 0-30V, or 0-20ma, 4-20ma, with built-in software and hardware watchdog, industrial grade components, and stable operation in an industrial environment of -40~85 ° C.
Building a High Channel Density Digital IO Module for the Next Generation Industrial Automation Controller
There are currently many articles introducing Industry 4.0, and smart sensors are becoming increasingly popular in factory environments (I and other authors have written about these topics). Although we have all noticed a significant increase in the use of sensors in factories, processing plants, and even some newly built automation systems, the widespread use of sensors has also brought about an important change, which is the need to handle a large amount of IO within these old controllers. These IOs may be digital or analog. This requires the construction of high-density IO modules with size and heat limitations.
Usually, digital IO in PLC consists of discrete devices such as resistors/capacitors or independent FET drives. In order to minimize the size of the controller as much as possible and to handle 2 to 4 times the number of channels, this has led to a shift from a separate approach to an integrated approach.3502E Safety Instrumented System (SIS)
We can use the entire article to illustrate the drawbacks of the split method, especially when the number of channels processed by each module reaches 8 or more. However, when it comes to high heat/power consumption, a large number of split components (from the perspective of size and mean time between failures (MTBF)), and the need for reliable system specifications, it is sufficient to demonstrate that the split method is not feasible.
Figure 1 shows the technical challenges faced in building high-density digital input (DI) and digital output (DO) modules. In both DI and DO systems, size and heat dissipation issues need to be considered.
Design a High Channel Density Digital Input Module
The traditional split design uses a resistive voltage divider network to convert 24V/48V signals into signals that can be used by microcontrollers. The front-end can also use discrete RC filters. If isolation is required, external optocouplers are sometimes used
For example, the current limiting value of DI devices in ADI is 3.5mA/channel. So, as shown in the figure, we use two channels in parallel. If the system must be connected to a Type 2 input, adjust the REFDI resistance and RIN resistance. For some newer components, we can also use pins or select current values through software.
To support a 48V digital input signal (not a common requirement), a similar process needs to be used, and an external resistor must be added to adjust the voltage threshold at one end of the field. Set the value of this external resistor so that the current limiting value * R+threshold of the pin meets the voltage threshold specification at one end of the field (see device data manual).
Finally, due to the connection between the digital input module and the sensor, the design must meet the requirements of reliable operating characteristics. When using a split type scheme, these protective functions must be carefully designed. When selecting integrated digital input devices, ensure that the following are determined according to industry standards:
Wide input voltage range (e.g. up to 40V).
Able to use on-site power supply (7V to 65V).
Capable of withstanding high ESD (± 15kV ESD air gap) and surges (usually 1KV).
Providing overvoltage and overheating diagnosis is also very useful for MCU to take appropriate actions.
Design a High Channel Density Digital Output Module
A typical discrete digital output design has a FET with a driving circuit driven by a microcontroller. Different methods can be used to configure FETs to drive microcontrollers.
The definition of a high-end load switch is that it is controlled by an external enable signal and connects or disconnects the power supply from a given load. Compared to low-end load switches, high-end switches provide current to the load, while low-end switches connect or disconnect the grounding connection of the load to obtain current from the load. Although they all use a single FET, the problem with low-end switches is that there may be a short circuit between the load and ground. High end switches protect the load and prevent short circuits to ground. However, the implementation cost of low-end switches is lower. Sometimes, the output driver is also configured as a push-pull switch, requiring two MOSFETs. Refer to Figure 4 below.
Integrated DO devices can integrate multiple DO channels into a single device. Due to the different FET configurations used for high-end, low-end, and push-pull switches, different devices can be used to achieve each type of output driver.
What are the advantages of Ethernet remote IO modules that can be cascaded?
Advantages and specific application scenarios of Ethernet remote IO modules that can be cascaded
For scenarios where data collection control points are linearly distributed, such as streetlights, bridges, streetlights, digital factories, parking lot parking monitoring, smart parking lots, smart parking racks, and building automation control systems in smart parks, using cascading dual Ethernet remote IO modules saves more costs than using single Ethernet remote IO modules.
The Ethernet remote IO module that can be cascaded is a new type of Ethernet remote IO module that supports MAC layer data exchange and can achieve hand in hand connection. This not only saves switch interfaces, but also reduces a large amount of Ethernet cable costs, wiring space, and wiring costs.
Its advantages are as follows:3502E Safety Instrumented System (SIS)
1. No need for a large number of Ethernet switches or occupying Ethernet switch ports;
2. It can save a lot of Ethernet cables, cable space, and labor costs for installing cables;
3. The overall cost has significantly decreased;
4. Supports both Modbus RTU protocol, Modbus TCP protocol, and the Internet of Things protocol MQTT protocol;
5. Support TCP Server and TCP Client services;3502E Safety Instrumented System (SIS)
6. Can be connected to SCADA systems, PLC systems, or cloud platforms;
7. The series uses a MAC layer for data exchange, ensuring that network connectivity does not cause communication issues with subsequent devices due to device failures in the middle.
The comparison between cascaded Ethernet remote IO modules and traditional IO modules used in building automation systems is shown in the following figure:
1. Adopting a cascaded dual Ethernet remote IO module, data acquisition and control wiring for floors with a height of 70 meters only requires a 70 meter Ethernet cable;
2. Using a traditional single Ethernet remote IO module, the data acquisition and control system wiring for a 70 meter high floor requires a 280 meter Ethernet cable.
It can be seen that using cascaded dual Ethernet remote IO modules can save a lot of wiring costs compared to traditional single Ethernet remote IO modules.
Application of Ethernet Remote IO Module in Building Automation System
For building automation systems, each data acquisition control point is linearly distributed in each floor. Therefore, it is very suitable to use Ethernet remote IO modules that can be cascaded to achieve data acquisition and control.
The Ethernet remote IO module that can be cascaded supports MAC layer data exchange and can achieve a hand in hand connection method. This can not only save switch interfaces, but also reduce a large amount of Ethernet cable costs, wiring space, and wiring costs.
Its advantages are as follows:
1. No need for a large number of Ethernet switches or occupying Ethernet switch ports;
2. It can save a lot of Ethernet cables, cable space, and labor costs for installing cables;
3. The overall cost has significantly decreased;
4. The M160E supports both Modbus RTU protocol, Modbus TCP protocol, and the Internet of Things protocol MQTT protocol. In addition, it also supports TCP Server and TCP Client services; Can be connected to SCADA systems, PLC systems, or cloud platforms;
4. The M160E series uses a MAC layer for data exchange, ensuring that network connectivity does not cause communication issues with subsequent devices due to device failures in the middle.
Comparison between cascaded Ethernet remote IO modules and traditional IO modules for building automation systems:
1. Adopting a cascaded dual Ethernet remote IO module, data acquisition and control wiring for floors with a height of 70 meters only requires a 70 meter Ethernet cable;
2. Using a traditional single Ethernet remote IO module, the data acquisition and control system wiring for a 70 meter high floor requires a 280 meter Ethernet cable.
Therefore, we can conclude that for scenarios where data collection control points are linearly distributed, such as streetlights, bridges, streetlights, digital factories, parking lot parking monitoring, smart parking lots, smart parking racks, and building automation systems in smart parks, using cascading dual Ethernet remote IO modules saves more costs than using single Ethernet remote IO modules.
1.Has been engaged in industrial control industry for a long time, with a large number of inventories.
2.Industry leading, price advantage, quality assurance
3.Diversified models and products, and all kinds of rare and discontinued products
4.15 days free replacement for quality problems
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