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3623T TRICONEX nput/output communication card
3623T TRICONEX nput/output communication card
Module Clips Drive controller servo motor
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What IO combinations can a mini PLC combine with to achieve automated control?
At present, there are two main design modes for controllers like PLC, one is integrated design and the other is modular design. From the name, we can feel that there are two different PLCs, one that cannot be disassembled and the other that can be disassembled. Due to the fact that the main control module and IO module of the modular PLC can be spliced as needed, its volume and weight are usually very small, and we cannot call it a mini PLC too much. So, what IO combinations can such a small gadget combine with to achieve automation control? Let”s take a brief inventory:3623T TRICONEX nput/output communication card
1. Firstly, there is the digital quantity acquisition IO module, which is used to collect digital quantity information. Typical examples include counter IO, PNP type digital quantity acquisition IO, NPN type digital quantity acquisition IO, etc.
2. Then there is the digital output IO module, which is used to send digital instructions. The most typical example is PWM output IO, which can output pulse signals to control servo motors or stepper motors for operation.
3. After talking about digital IO, let”s talk about analog IO. Analog signal acquisition type IO includes voltage signal acquisition, current signal acquisition, and temperature signal acquisition. The IO for collecting temperature signals includes PT100, PT1000, and various thermocouple temperature acquisition modules.
4. Finally, there are analog output IO, as well as output current signals and voltage signals.
In addition to the above IO modules, our modular PLC also supports extended communication interfaces, further enhancing the equipment”s scalability.
Module Input/Output (I/O) Knowledge3623T TRICONEX nput/output communication card
Module Input/Output (I/O) Knowledge
I think it”s necessary to talk about the sorting of the input and output ports of the module. Generally, we can divide it into IO functional division and IO specifications.
The purpose of the former is mainly to convert all functions into actual division into MCU IO ports, while the purpose of the latter is to determine the specifications of all IO ports. Of course, you can completely skip these tasks, and it”s also possible. Depending on the company”s requirements, I think individuals still consider them as a work habit.
The following examples are all created for my blog post. If there are any duplicate names, please do not contact me.
Looking at the above figure, first determine all input and output functions and power input, as well as communication.
Then separate the power distribution with different lines, and start organizing each power supply line and processing process. The final purpose of the entire diagram is to clearly allocate the input and output sequence.
The IO specification is to provide a detailed description of all interfaces, crystal oscillators, and other information to the MCU.
1. Enter the number of low effective interfaces and how much pull-up resistance (switch wet current) is required (how much current does the microcontroller need to absorb, which may be injected into the microcontroller after pull-up).
2. Enter the number of highly effective interfaces, how many pull-down resistors are required (switch wet current), (how much current does the microcontroller need to absorb, and it is possible to inject the microcontroller after the switch is effective)
3. Number of analog input interfaces, evaluate whether the analog ports of the microcontroller are sufficient, and confirm the required analog conversion accuracy. Evaluate whether the A/D conversion reference voltage needs to be replaced (to meet accuracy requirements). Consider how many power supplies need to be tested and how many analog input ports are configured.
4. Evaluate the requirements for crystal oscillator accuracy and whether a phase-locked loop is required.
The above requirements are mainly aimed at module design and need to be confirmed during the early development of the module. All requirements can be organized using an Excel table and displayed in the diagram.
Distributed dual Ethernet IO module
The distributed dual Ethernet IO module adopts an industrial grade design, which meets the demanding industrial application scenarios. It is equipped with a dedicated high-performance Ethernet chip, which can quickly achieve cascade networking between IO modules without the need for repeated wiring, saving on-site wiring costs.
The distributed dual Ethernet IO module comes with switch input, switch output, relay output, analog input, analog input, thermal resistance input, etc. It supports high-speed pulse input counting and high-speed pulse output, and is designed specifically for industrial field data collection, measurement, and control. The distributed dual Ethernet IO module supports Modbus TCP protocol and Modbus RTU protocol for uplink, which can quickly connect to existing DCS, SCADA, PLC, HMI and other systems. The distributed dual Ethernet IO module supports one RS485 interface and supports Modbus RTU Master function. It can expand the IO module, read and write intelligent instrument data, or connect to HMI, DCS, PLC and other devices as a Modbus Slave.
What is the difference between remote IO and distributed IO
People often discuss the difference between remote IO and distributed IO. However, some people believe that they are the same and terms can be exchanged, while others believe the opposite. What is the difference between remote I/O and distributed I/O? The following is a guide from remote IO manufacturer Zhongshan Technology to understand the difference between remote IO and distributed IO.
Remote and distributed within the location range.3623T TRICONEX nput/output communication card
Today”s DCS is a control system with many distributed autonomous controllers, each with many continuous operations. This controller is bundled together by a central monitoring controller. We have used the terms remote and distributed in the locations of I/O and controllers. It is easy to see how these terms are misunderstood.
From the perspective of PLC, remote I/O represents the actual distance that the I/O module is away from the control PLC. Distributed I/O is very intelligent, as mentioned earlier, remote I/O is sometimes referred to as distributed I/O. Let”s take a look at the definition of distributed I/O. This definition is different from remote I/O.
Generally speaking, distributed I/O has a brain or some computing power. By default, it is remote. As mentioned earlier, remote I/O is located physically far from the control PLC. Remote I/O has no brain and cannot perform any computational functions at all. It can be said with certainty that when you hear the term remote I/O, it only involves one controller or PLC, while distributed I/O has multiple controllers.
ZSR-Ethernet-2184 is a distributed Ethernet RTU that supports 4-way switch digital input (Di), 8-way analog input (Ai), 4-way relay (Do) output, 1-way RS485 serial port data acquisition to Ethernet, and Modbus RTU terminal. Merge 485 to Ethernet serial port server function, support Modbus to TCP/UDP protocol conversion, support virtual serial port, and interface with various configuration software. Supports signal acquisition in the range of 0-5V, 0-10V, 0-30V, or 0-20ma, 4-20ma, with built-in software and hardware watchdog, industrial grade components, and stable operation in an industrial environment of -40~85 ° C.
Building a High Channel Density Digital IO Module for the Next Generation Industrial Automation Controller
There are currently many articles introducing Industry 4.0, and smart sensors are becoming increasingly popular in factory environments (I and other authors have written about these topics). Although we have all noticed a significant increase in the use of sensors in factories, processing plants, and even some newly built automation systems, the widespread use of sensors has also brought about an important change, which is the need to handle a large amount of IO within these old controllers. These IOs may be digital or analog. This requires the construction of high-density IO modules with size and heat limitations.
Usually, digital IO in PLC consists of discrete devices such as resistors/capacitors or independent FET drives. In order to minimize the size of the controller as much as possible and to handle 2 to 4 times the number of channels, this has led to a shift from a separate approach to an integrated approach.3623T TRICONEX nput/output communication card
We can use the entire article to illustrate the drawbacks of the split method, especially when the number of channels processed by each module reaches 8 or more. However, when it comes to high heat/power consumption, a large number of split components (from the perspective of size and mean time between failures (MTBF)), and the need for reliable system specifications, it is sufficient to demonstrate that the split method is not feasible.
Figure 1 shows the technical challenges faced in building high-density digital input (DI) and digital output (DO) modules. In both DI and DO systems, size and heat dissipation issues need to be considered.
Design a High Channel Density Digital Input Module
The traditional split design uses a resistive voltage divider network to convert 24V/48V signals into signals that can be used by microcontrollers. The front-end can also use discrete RC filters. If isolation is required, external optocouplers are sometimes used
For example, the current limiting value of DI devices in ADI is 3.5mA/channel. So, as shown in the figure, we use two channels in parallel. If the system must be connected to a Type 2 input, adjust the REFDI resistance and RIN resistance. For some newer components, we can also use pins or select current values through software.
To support a 48V digital input signal (not a common requirement), a similar process needs to be used, and an external resistor must be added to adjust the voltage threshold at one end of the field. Set the value of this external resistor so that the current limiting value * R+threshold of the pin meets the voltage threshold specification at one end of the field (see device data manual).
Finally, due to the connection between the digital input module and the sensor, the design must meet the requirements of reliable operating characteristics. When using a split type scheme, these protective functions must be carefully designed. When selecting integrated digital input devices, ensure that the following are determined according to industry standards:
Wide input voltage range (e.g. up to 40V).
Able to use on-site power supply (7V to 65V).
Capable of withstanding high ESD (± 15kV ESD air gap) and surges (usually 1KV).
Providing overvoltage and overheating diagnosis is also very useful for MCU to take appropriate actions.
Design a High Channel Density Digital Output Module
A typical discrete digital output design has a FET with a driving circuit driven by a microcontroller. Different methods can be used to configure FETs to drive microcontrollers.
The definition of a high-end load switch is that it is controlled by an external enable signal and connects or disconnects the power supply from a given load. Compared to low-end load switches, high-end switches provide current to the load, while low-end switches connect or disconnect the grounding connection of the load to obtain current from the load. Although they all use a single FET, the problem with low-end switches is that there may be a short circuit between the load and ground. High end switches protect the load and prevent short circuits to ground. However, the implementation cost of low-end switches is lower. Sometimes, the output driver is also configured as a push-pull switch, requiring two MOSFETs. Refer to Figure 4 below.
Integrated DO devices can integrate multiple DO channels into a single device. Due to the different FET configurations used for high-end, low-end, and push-pull switches, different devices can be used to achieve each type of output driver.
What is the function of an IO chip
Io generally refers to input and output devices, where I is the input and O is the output. The input to the IO port of the chip is the external signal transmission to the chip, while the output is the internal signal transmission to other devices. The input and output are relative. In short, in a broad sense, the control of input and output interfaces is called an IO chip, and network cards are also considered IO or array cards.
The CPU must read and write data to external registers or ROMs on RAM or other hardware through IO commands (such as input/output commands). For example, reading a keyboard involves accessing external registers on the keyboard through the 60H port, and the chip on the keyboard scans the keyboard. Pressing or holding down a key for a long time will cause the chip to generate corresponding scan or break codes, which will be written to the external register of the 60H port, so that the CPU can achieve the purpose of controlling the keyboard. Therefore, I think IO chips should refer to a large category. The CPU already has powerful IO instructions and corresponding control buses.
51 microcontroller IO port input and output mode_ Four usage methods for IO ports
The traditional 51 microcontroller IO interface can only be used as a standard bidirectional IO interface. If it is used to drive LED, it can only be driven by injecting current or using a transistor external expansion drive circuit.
Current injection method: LED positive pole connected to VCC, negative pole connected to IO port. If the IO is at a high level, the two poles of the LED are at the same level, and there is no current, the LED will turn off; IO is at low power level, current flows from VCC to IO, and LED lights up. But when you connect the positive pole of the LED to the IO interface and the negative pole to GND, placing the IO interface at a high level will cause the LED to light up. However, due to the insufficient pull-up capability of the IO interface, the brightness is not ideal. The following method can be used to solve this problem.
Push-pull working mode: The positive and negative poles of the LED are connected to two IO ports, and then the positive IO interface is set as the push-pull output, while the negative IO interface is set as the standard bidirectional current input. The push pull method has strong pull-up ability and can achieve high-level LED driving.
Four usage methods for IO ports3623T TRICONEX nput/output communication card
From the perspective of the characteristics of the I/O port, the P0 port of Standard 51 is an open drain structure when used as an I/O port, and in practical applications, a pull-up resistor is usually added; P1, P2, and P3 are all quasi bidirectional I/Os with internal pull-up resistors, which can be used as both input and output. The I/O port characteristics of the LPC900 series microcontroller have certain differences, and they can be configured into four different working modes: quasi bidirectional I/O, push pull output, high resistance input, and open drain.
Compared with Standard 51, the quasi bidirectional I/O mode differs in internal structure but is similar in usage. For example, when used as an input, it must first write “1” to set it to high level before reading the level state of the pin.!!!!! Why is it like this? Please refer to the diagram below for analysis.
The characteristic of push-3623T TRICONEX nput/output communication cardpull output is that it can drive a large current regardless of whether it outputs high or low levels. For example, when outputting high levels, it can directly light up the LED (by connecting several hundred ohm current limiting resistors in series), which is difficult to achieve in quasi bidirectional I/O mode.
The characteristic of high impedance input mode is that it can only be used as an input, but it can obtain relatively high input impedance, which is necessary in analog comparator and ADC applications.
The open drain mode is similar to the quasi bidirectional mode, but there is no internal pull-up resistance. The advantage of open drain mode is good electrical compatibility. If the external pull-up resistor is connected to a 3V power supply, it can interface with a 3V logic device. If the pull-up resistor is connected to a 5V power supply, it can also interface with a 5V logic device. In addition, the open drain mode can also conveniently implement the “line and” logic function.
For the explanation of the above question, there is this information:
High resistance state is a common term in digital circuits, referring to an output state of a circuit that is neither high nor low. If the high resistance state is input into the next level circuit, it has no impact on the lower level circuit, just like not connected. If measured with a multimeter, it may be high or low, depending on what is connected afterwards.
High resistance states can be understood as open circuits during circuit analysis. You can think of it as having a very high output (input) resistance. His limit can be considered suspended.
Typical applications of high resistance states:
1. On the bus connected structure. There are multiple devices hanging on the bus, and the devices are connected to the bus in a high impedance form. This automatically releases the bus when the device does not occupy it, making it easier for other devices to gain access to the bus.
2. Most microcontroller I/O can be set to high impedance input when used, such as Lingyang, AVR, and so on. High resistance input can be considered as having infinite input resistance, indicating that I/O has minimal impact on the preceding stage and does not generate current (without attenuation), and to some extent, it also increases the chip”s resistance to voltage surges.
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