Description
4201 TRICONEX nput/output communication card
4201 TRICONEX nput/output communication card
Module Clips Drive controller servo motor
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What is the difference between remote IO and distributed IO
People often discuss the difference between remote IO and distributed IO. However, some people believe that they are the same and terms can be exchanged, while others believe the opposite. What is the difference between remote I/O and distributed I/O? The following is a guide from remote IO manufacturer Zhongshan Technology to understand the difference between remote IO and distributed IO.
Remote and distributed within the location range.4201 TRICONEX nput/output communication card
Today”s DCS is a control system with many distributed autonomous controllers, each with many continuous operations. This controller is bundled together by a central monitoring controller. We have used the terms remote and distributed in the locations of I/O and controllers. It is easy to see how these terms are misunderstood.
From the perspective of PLC, remote I/O represents the actual distance that the I/O module is away from the control PLC. Distributed I/O is very intelligent, as mentioned earlier, remote I/O is sometimes referred to as distributed I/O. Let”s take a look at the definition of distributed I/O. This definition is different from remote I/O.
Generally speaking, distributed I/O has a brain or some computing power. By default, it is remote. As mentioned earlier, remote I/O is located physically far from the control PLC. Remote I/O has no brain and cannot perform any computational functions at all. It can be said with certainty that when you hear the term remote I/O, it only involves one controller or PLC, while distributed I/O has multiple controllers.
ZSR-Ethernet-2184 is a distributed Ethernet RTU that supports 4-way switch digital input (Di), 8-way analog input (Ai), 4-way relay (Do) output, 1-way RS485 serial port data acquisition to Ethernet, and Modbus RTU terminal. Merge 485 to Ethernet serial port server function, support Modbus to TCP/UDP protocol conversion, support virtual serial port, and interface with various configuration software. Supports signal acquisition in the range of 0-5V, 0-10V, 0-30V, or 0-20ma, 4-20ma, with built-in software and hardware watchdog, industrial grade components, and stable operation in an industrial environment of -40~85 ° C.
Building a High Channel Density Digital IO Module for the Next Generation Industrial Automation Controller
There are currently many articles introducing Industry 4.0, and smart sensors are becoming increasingly popular in factory environments (I and other authors have written about these topics). Although we have all noticed a significant increase in the use of sensors in factories, processing plants, and even some newly built automation systems, the widespread use of sensors has also brought about an important change, which is the need to handle a large amount of IO within these old controllers. These IOs may be digital or analog. This requires the construction of high-density IO modules with size and heat limitations.
Usually, digital IO in PLC consists of discrete devices such as resistors/capacitors or independent FET drives. In order to minimize the size of the controller as much as possible and to handle 2 to 4 times the number of channels, this has led to a shift from a separate approach to an integrated approach.4201 TRICONEX nput/output communication card
We can use the entire article to illustrate the drawbacks of the split method, especially when the number of channels processed by each module reaches 8 or more. However, when it comes to high heat/power consumption, a large number of split components (from the perspective of size and mean time between failures (MTBF)), and the need for reliable system specifications, it is sufficient to demonstrate that the split method is not feasible.
Figure 1 shows the technical challenges faced in building high-density digital input (DI) and digital output (DO) modules. In both DI and DO systems, size and heat dissipation issues need to be considered.
Design a High Channel Density Digital Input Module
The traditional split design uses a resistive voltage divider network to convert 24V/48V signals into signals that can be used by microcontrollers. The front-end can also use discrete RC filters. If isolation is required, external optocouplers are sometimes used
For example, the current limiting value of DI devices in ADI is 3.5mA/channel. So, as shown in the figure, we use two channels in parallel. If the system must be connected to a Type 2 input, adjust the REFDI resistance and RIN resistance. For some newer components, we can also use pins or select current values through software.
To support a 48V digital input signal (not a common requirement), a similar process needs to be used, and an external resistor must be added to adjust the voltage threshold at one end of the field. Set the value of this external resistor so that the current limiting value * R+threshold of the pin meets the voltage threshold specification at one end of the field (see device data manual).
Finally, due to the connection between the digital input module and the sensor, the design must meet the requirements of reliable operating characteristics. When using a split type scheme, these protective functions must be carefully designed. When selecting integrated digital input devices, ensure that the following are determined according to industry standards:
Wide input voltage range (e.g. up to 40V).
Able to use on-site power supply (7V to 65V).
Capable of withstanding high ESD (± 15kV ESD air gap) and surges (usually 1KV).
Providing overvoltage and overheating diagnosis is also very useful for MCU to take appropriate actions.
Design a High Channel Density Digital Output Module
A typical discrete digital output design has a FET with a driving circuit driven by a microcontroller. Different methods can be used to configure FETs to drive microcontrollers.
The definition of a high-end load switch is that it is controlled by an external enable signal and connects or disconnects the power supply from a given load. Compared to low-end load switches, high-end switches provide current to the load, while low-end switches connect or disconnect the grounding connection of the load to obtain current from the load. Although they all use a single FET, the problem with low-end switches is that there may be a short circuit between the load and ground. High end switches protect the load and prevent short circuits to ground. However, the implementation cost of low-end switches is lower. Sometimes, the output driver is also configured as a push-pull switch, requiring two MOSFETs. Refer to Figure 4 below.
Integrated DO devices can integrate multiple DO channels into a single device. Due to the different FET configurations used for high-end, low-end, and push-pull switches, different devices can be used to achieve each type of output driver.
Definition of IO Link Protocol and Its Interface
IO Link is a peer-to-peer, serial digital communication protocol designed for periodic data exchange between sensors/actuators and controllers (PLCs). The IO Link protocol was first proposed by Siemens and has now become an international standard IEC 61131-9. With the advancement of Industry 4.0, the use of IO Link is becoming increasingly widespread. Today”s article will introduce the definition of the IO Link protocol and its interfaces.
Factory automation can be divided into execution layer, on-site layer, on-site control layer, workshop control layer, and management layer according to functional division. As shown in the following figure:
The execution layer includes various execution mechanisms (valves, pumps, motors, etc.) and sensors, which are the muscles and peripheral nerves of factory automation. They receive commands from the upper layer and complete specified actions.
The on-4201 TRICONEX nput/output communication card site layer includes various distributed IO4201 TRICONEX nput/output communication card systems, which are the central nervous system of factory automation. It conveys control instructions from the upper layer to the execution layer; And feedback the signals from the execution layer to the control layer, serving as the information center;
The on-site control layer includes various PLC systems, which are the brains of factory automation. It issues corresponding instructions and commands the execution layer to complete corresponding actions based on internal program requirements and signal feedback from the execution layer;
The workshop control layer (MES) and management layer communicate with various PLC systems at the management level to complete management tasks at the workshop and factory levels.
The IO Link protocol to be introduced in this article is a protocol that transfers data between the execution layer and the field layer. An IO Link system consists of the following components:
1) IO Link Master;
2) IO Link Device;
3) Non shielded 3-5 core standard cable;
4) Tools for configuring IO Link parameters;
The IO Link Master transfers data between the IO Link device and the PLC. It is usually a distributed IO module with IO Link connection channels on the module. The IO Link Device is connected to the channel of the IO Link Master through a cable, and the IO Link Master exchanges data with the PLC through a bus. As shown in the following figure:
Every IO Link device needs to be connected to a channel of the IO Link supervisor, so IO Link is a peer-to-peer communication protocol, not a bus protocol.
IO Link devices are divided into two types: sensors and actuators: sensors are usually the four pin interface of M12, and actuators are usually the five pin interface of M12.
According to IEC 60974-5-2, the definition of IO Link Device pins follows the following regulations:
1) Pin 1 (PIN1): 24V power supply positive pole;
2) Pin 3 (PIN3): 0V
3) Pin 4 (PIN4): IO Link communication or standard IO output;
The pin definition of the IO Link device is shown in the following figure:
Which types of equipment should PLC module manufacturers develop first?
We know that PLC, also known as programmable logic controller, collects variable data through various IOs to achieve the purpose of automated control. Therefore, developing PLC is largely about developing IO. However, with so many types of IO, which PLC module manufacturers should develop first? Let me share my opinion:
1. Digital input IO, including PNP and NPN digital input IO, counter input IO, etc.
2. Digital output IO, including PNP and NPN digital output IO, PWM pulse output IO, relay output IO, and so on.
3. Analog input IO, including current acquisition input IO, voltage acquisition input IO, temperature acquisition input IO, and so on. The current input IO can collect currents ranging from 0 to 20 milliamperes, while the voltage input IO can collect voltages ranging from negative 10V to positive 10V. Temperature acquisition IO includes thermocouples and thermal resistors.
4. The style of analog output IO is similar to that of analog input IO, but does not include temperature analog, mainly voltage and current type.
What IO combinations can a mini PLC combine with to achieve automated control?
At present, there are two main design modes for controllers like PLC, one is integrated design and the other is modular design. From the name, we can feel that there are two different PLCs, one that cannot be disassembled and the other that can be disassembled. Due to the fact that the main control module and IO module of the modular PLC can be spliced as needed, its volume and weight are usually very small, and we cannot call it a mini PLC too much. So, what IO combinations can such a small gadget combine with to achieve automation control? Let”s take a brief inventory:4201 TRICONEX nput/output communication card
1. Firstly, there is the digital quantity acquisition IO module, which is used to collect digital quantity information. Typical examples include counter IO, PNP type digital quantity acquisition IO, NPN type digital quantity acquisition IO, etc.
2. Then there is the digital output IO module, which is used to send digital instructions. The most typical example is PWM output IO, which can output pulse signals to control servo motors or stepper motors for operation.
3. After talking about digital IO, let”s talk about analog IO. Analog signal acquisition type IO includes voltage signal acquisition, current signal acquisition, and temperature signal acquisition. The IO for collecting temperature signals includes PT100, PT1000, and various thermocouple temperature acquisition modules.
4. Finally, there are analog output IO, as well as output current signals and voltage signals.
In addition to the above IO modules, our modular PLC also supports extended communication interfaces, further enhancing the equipment”s scalability.
Module Input/Output (I/O) Knowledge4201 TRICONEX nput/output communication card
Module Input/Output (I/O) Knowledge
I think it”s necessary to talk about the sorting of the input and output ports of the module. Generally, we can divide it into IO functional division and IO specifications.
The purpose of the former is mainly to convert all functions into actual division into MCU IO ports, while the purpose of the latter is to determine the specifications of all IO ports. Of course, you can completely skip these tasks, and it”s also possible. Depending on the company”s requirements, I think individuals still consider them as a work habit.
The following examples are all created for my blog post. If there are any duplicate names, please do not contact me.
Looking at the above figure, first determine all input and output functions and power input, as well as communication.
Then separate the power distribution with different lines, and start organizing each power supply line and processing process. The final purpose of the entire diagram is to clearly allocate the input and output sequence.
The IO specification is to provide a detailed description of all interfaces, crystal oscillators, and other information to the MCU.
1. Enter the number of low effective interfaces and how much pull-up resistance (switch wet current) is required (how much current does the microcontroller need to absorb, which may be injected into the microcontroller after pull-up).
2. Enter the number of highly effective interfaces, how many pull-down resistors are required (switch wet current), (how much current does the microcontroller need to absorb, and it is possible to inject the microcontroller after the switch is effective)
3. Number of analog input interfaces, evaluate whether the analog ports of the microcontroller are sufficient, and confirm the required analog conversion accuracy. Evaluate whether the A/D conversion reference voltage needs to be replaced (to meet accuracy requirements). Consider how many power supplies need to be tested and how many analog input ports are configured.
4. Evaluate the requirements for crystal oscillator accuracy and whether a phase-locked loop is required.
The above requirements are mainly aimed at module design and need to be confirmed during the early development of the module. All requirements can be organized using an Excel table and displayed in the diagram.
Distributed dual Ethernet IO module
The distributed dual Ethernet IO module adopts an industrial grade design, which meets the demanding industrial application scenarios. It is equipped with a dedicated high-performance Ethernet chip, which can quickly achieve cascade networking between IO modules without the need for repeated wiring, saving on-site wiring costs.
The distributed dual Ethernet IO module comes with switch input, switch output, relay output, analog input, analog input, thermal resistance input, etc. It supports high-speed pulse input counting and high-speed pulse output, and is designed specifically for industrial field data collection, measurement, and control. The distributed dual Ethernet IO module supports Modbus TCP protocol and Modbus RTU protocol for uplink, which can quickly connect to existing DCS, SCADA, PLC, HMI and other systems. The distributed dual Ethernet IO module supports one RS485 interface and supports Modbus RTU Master function. It can expand the IO module, read and write intelligent instrument data, or connect to HMI, DCS, PLC and other devices as a Modbus Slave.
1.Has been engaged in industrial control industry for a long time, with a large number of inventories.
2.Industry leading, price advantage, quality assurance
3.Diversified models and products, and all kinds of rare and discontinued products
4.15 days free replacement for quality problems
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